Loading...

Course Description

In Thin Films, you’ll explore a range of topics including equipment and processes for depositing and removing thin films in IC fabricating, vacuum technology to provide controlled environments, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma and reactive-on etch (RIE) processes, chemical mechanical planarization (CMP), and the underlying physics and chemistry. You’ll walk away from this course understanding deposition and etch processes, parameter space dependencies, how to characterize thin films, address integration challenges, and the operation of various vacuum systems.

Course Outcomes

  • Understand deposition/etch processes
    Knowledge of the chemistry and physics involved in deposition/etch processes
  • Describe parameter space dependencies
    Understand and describe the parameter space dependencies associated with thin films
  • Characterize thin films
    Describe basic techniques and metrics for characterizing thin films
  • Assess integration challenges
    Assess the challenges of integrating a new material into an existing process
  • Understand vacuum system operations
    Describe the operation of various vacuum systems

The Learning Experience

This asynchronous course is designed for participants from broad-ranging technical educational backgrounds, including students from various engineering and physical sciences disciplines. This course is also appropriate for early-career industry professionals, community college students and faculty, and any individual holding an AS or BS degree in a STEM field interested in a career in the vibrant semiconductor industry.

Applies Towards the Following Certificates

Loading...
Enroll Now - Select a section to enroll in
Section Title
Thin Films
Type
Online/Asynchronous
Dates
Jan 26, 2026 to Mar 23, 2026
Course Fee(s)
Tuition non-credit $695.00
Potential Discount(s)
Drop Request Deadline
Feb 09, 2026
Transfer Request Deadline
Feb 09, 2026
Required fields are indicated by .