CE-CORP-6000 - Fundamentals of Surface Mount Technology with Lab

Course Description

Building a strong foundation is important if you want to gain a deeper understanding of the electronics manufacturing industry, and in Fundamentals of Surface Mount Technology, you’ll gain a foundation you can continue to build on. No matter how much experience you have in engineering and electronics manufacturing, this course will give you the chance to become proficient in the latest advances related to the process and gain hands-on experience with key steps in the manufacturing process.

Is This Course For You?

The course is designed for both new and experienced professionals in the electronics manufacturing industry interested in learning more about the primary electronics manufacturing methods. Whether you’re in an entry level position and looking to gain a better understanding of the industry or an experienced engineer interested in learning more about processes you don’t have personal experience with, this course will help you gain more knowledge and hands-on experience with the different facets of the electronics manufacturing industry.

Course Outline

What You’ll Learn

Throughout this course, you’ll dive into the primary electronics manufacturing methods, such as stencil printing, pick and place, reflow, and inspection, and you’ll also be introduced to wave soldering, dispensing, and rework and reliability. While learning about the processes for these methods, you’ll also gain an understanding of what steps in the process can produce certain defects or bottlenecks and consider possible solutions for low, medium, and high-volume products.

How You’ll Learn

This hybrid course will include asynchronous online content as well as synchronous in-person labs. You’ll spend about 4-6 hours on content each week between in person and online coursework, consisting of lectures, module examination time, work on your final project, and hands-on labs. The in-person labs will cover a range of topics related to electronic manufacturing, including component identification, reflow soldering, rework and repair, and more. The course will culminate in a final Product Tear-Down Project that incorporates the different topics you’ve covered which can be added to your professional portfolio to exemplify the skills and knowledge you’ve gained from this course.

Learner Outcomes

Skills You Walk Away With

By the end of this course, you will be able to:

Demonstrate knowledge of the electronics manufacturing process
Apply critical thinking skills to overcome process challenges
Assess circuit board designs and evaluate their manufacturing differences
Estimate SMT production throughput and consider bottlenecks
Classify components and manufacturing methods
Calculate Area Ratio and Aspect Ratio for evaluating stencil designs
Analyze Solder Paste Inspection (SPI) data
Recognize Pick and Place (PnP) process variables that can cause production delays and defects
Explain reflow process limitations and develop best practices for solder reflow
Evaluate downstream processes (following SMT and wave soldering), for example, cleaning, coating, testing, and final assembly